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3DMMIC
3DMMIC
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From 3D MMIC integration to learning-based smart manufacturing, 3DMMIC develops practical solutions for compound semiconductor applications.

Innovation in Motion

Bridging advanced semiconductor integration and AI-driven manufacturing intelligence. 

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Carving a Path in 3D MMIC

Enabling compact RF design through 3D integration and hybrid bonding. 

Explore 3D Solution

Learning Powers Manufacturing

Learning Powers Manufacturing

Turning proprietary Fab data into learning-based manufacturing intelligence. 

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Our Perspective

The future of semiconductor competitiveness is no longer defined only by smaller geometries or faster equipment.


It is defined by the ability to manage complexity — in RF architecture, thermal behavior, manufacturing flow, equipment constraints, and human decision-making.


3DMMIC operates at this intersection.


We develop technologies that address semiconductor complexity from two directions: 3D integration for compound semiconductor MMICs, and learning-based manufacturing intelligence for semiconductor Fab operations.

What We Do

3D Solution

Smart Manufacturing

Smart Manufacturing

3DMMIC re-architects compound semiconductor MMICs through wafer-level 3D integration.


By separating active and passive functions into vertically integrated wafers, our 3D Solution enables more compact RF layouts, more efficient use of compound semiconductor material, and RF / thermal co-design for next-generation MMIC applications.

Smart Manufacturing

Smart Manufacturing

Smart Manufacturing

3DMMIC develops learning-based AI models for semiconductor shop-floor decision-making.


Our Smart Manufacturing approach transforms proprietary Fab data and experienced human decisions into manufacturing intelligence for dispatching, scheduling, bottleneck management, delivery precision, and productivity improvement.

Why It Matters

Compound semiconductor innovation is becoming increasingly complex.


At the device level, RF performance, die size, passive networks, thermal distribution, and manufacturability must be considered together.


At the Fab level, product mix, WIP distribution, equipment constraints, Q-time pressure, bottlenecks, and delivery commitments change continuously.


3DMMIC focuses on practical technologies that help semiconductor companies manage these complexities with engineering discipline and learning-based intelligence.

Who We Are

Dr. Chang is an industry veteran and serial entrepreneur with extensive experience across Taiwan, China, and USA.  Ranging from R&D, manufacturing, sales, marketing, business development, and technology commercialization. 


Trained as a scientist and educated as a business leader, Dr. Chang combines deep technical insight with strategic management experience. He earned his D.Phil. in Physics from the University of Oxford and MBA as a Sloan Fellow from MIT Sloan School of Management.


At 3DMMIC, Dr. Chang leads the company’s strategic direction in advanced 3D MMIC integration and learning-based smart manufacturing solutions for semiconductor applications. 


Plus a mature team of engineers, entrepreneurs, industry veterans, business development professionals….. with 200+ years’ experience.  

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Join us to turn the industry upside down

三維先進股份有限公司

3DMMIC LLC.

台灣338018桃園市蘆竹區經國路902號2樓 (經國方略)

(HVW) 2 F., No. 902, JingGuo Rd., Luzhu Dist., Taoyuan City 338018, Taiwan +886-3-3460677 OPPORTUNITIES ARE FOR THOSE WHO SEE BEYOND.

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