Practical Intelligence for Advanced 3D Semiconductor Integration and Manufacturing
Innovation in Motion
Bridging advanced semiconductor integration and AI-driven manufacturing intelligence.
Carving a Path in 3D MMIC
Enabling compact RF design through 3D integration and hybrid bonding.
Learning Powers Manufacturing
Learning Powers Manufacturing
Turning proprietary fab data into learning-based manufacturing intelligence.
Our Perspective
The future of semiconductor competitiveness is no longer defined only by smaller geometries or faster equipment.
It is defined by the ability to manage complexity — in RF architecture, thermal behavior, manufacturing flow, equipment constraints, and human decision-making.
3DMMIC operates at this intersection.
We develop technologies that address semiconductor complexity from two directions: 3D integration for compound semiconductor MMICs, and learning-based manufacturing intelligence for semiconductor fab operations.
Why It Matters
Compound semiconductor innovation is becoming increasingly complex.
At the device level, RF performance, die size, passive networks, thermal distribution, and manufacturability must be considered together.
At the fab level, product mix, WIP distribution, equipment constraints, Q-time pressure, bottlenecks, and delivery commitments change continuously.
3DMMIC focuses on practical technologies that help semiconductor companies manage these complexities with engineering discipline and learning-based intelligence.
Leadership
Dr. Chin-Chi Chang is a semiconductor industry veteran and serial entrepreneur with experience spanning R&D, manufacturing, operations, business development, and technology commercialization across Taiwan, China, and the United States.
He earned his D.Phil. in Physics from the University of Oxford and an MBA as a Sloan Fellow from the MIT Sloan School of Management.
At 3DMMIC, Dr. Chang leads the company's vision of advancing semiconductor competitiveness through both advanced 3D integration technologies and AI-driven manufacturing intelligence.
Together with a multidisciplinary team possessing more than 200 years of combined industry experience, 3DMMIC brings expertise across semiconductor engineering, manufacturing operations, and technology commercialization.