{"version":"https://jsonfeed.org/version/1","title":"3DMMIC","home_page_url":"https://3dmmic.com","description":"3DMMIC","author":{"name":"3DMMIC"},"items":[{"id":"https://3dmmic.com/insights/f/from-dispatching-to-fab-level-decision-intelligence","html_content":"

Start with dispatching. Expand toward bottleneck, Q-time, batch, WIP, delivery risk, and closed-loop learning.

","url":"https://3dmmic.com/insights/f/from-dispatching-to-fab-level-decision-intelligence","title":"From Dispatching to Fab-Level Decision Intelligence","summary":"Start with dispatching. Expand toward bottleneck, Q-time, batch, WIP, delivery risk, and closed-loop learning.","date_modified":"2026-07-20T05:18:48Z"},{"id":"https://3dmmic.com/insights/f/a-practical-cu-polymer-path-for-3d-gaas-mmic-hybrid-bonding","html_content":"

Moving from generic material screening to a defensible engineering choice.

","url":"https://3dmmic.com/insights/f/a-practical-cu-polymer-path-for-3d-gaas-mmic-hybrid-bonding","title":"A Practical Cu + Polymer Path for 3D GaAs MMIC Hybrid Bonding ","summary":"Moving from generic material screening to a defensible engineering choice.","date_modified":"2026-07-16T13:29:01Z"},{"id":"https://3dmmic.com/insights/f/from-mortal-expertise-to-persistent-machine-intelligence","html_content":"

Human expertise is powerful but perishable. Machine intelligence can preserve, recombine, and scale decision knowledge.

","url":"https://3dmmic.com/insights/f/from-mortal-expertise-to-persistent-machine-intelligence","title":"From Mortal Expertise to Persistent Machine Intelligence","summary":"Human expertise is powerful but perishable. Machine intelligence can preserve, recombine, and scale decision knowledge.","date_modified":"2026-07-15T09:02:21Z"},{"id":"https://3dmmic.com/insights/f/how-mes-records-become-ai-ready-decision-data","html_content":"

Traditional MES records show what happened. AI-ready decision datasets explain what decision was made, under what context, and with what outcome.

","url":"https://3dmmic.com/insights/f/how-mes-records-become-ai-ready-decision-data","title":"How MES Records Become AI-Ready Decision Data","summary":"Traditional MES records show what happened. AI-ready decision datasets explain what decision was made, under what context, and with what outcome.","date_modified":"2026-07-14T09:12:25Z"},{"id":"https://3dmmic.com/insights/f/when-ai-becomes-the-first-interlocutor","html_content":"

When the first critic, first tutor, and first design reviewer become the model, the structure of expertise begins to change.

","url":"https://3dmmic.com/insights/f/when-ai-becomes-the-first-interlocutor","title":"When AI Becomes the First Interlocutor","summary":"When the first critic, first tutor, and first design reviewer become the model, the structure of expertise begins to change.","date_modified":"2026-07-13T05:14:02Z"},{"id":"https://3dmmic.com/insights/f/why-si-style-hybrid-bonding-is-not-the-default-answer-for-gaas","html_content":"

A practical material-combination view of hybrid bonding for 3D MMICs integration.

","url":"https://3dmmic.com/insights/f/why-si-style-hybrid-bonding-is-not-the-default-answer-for-gaas","title":"Why Si-Style Hybrid Bonding Is Not the Default Answer for GaAs","summary":"A practical material-combination view of hybrid bonding for 3D MMICs integration.","date_modified":"2026-07-10T04:23:06Z"},{"id":"https://3dmmic.com/insights/f/why-proprietary-fab-data-matters-more-than-public-ai-models","html_content":"

Public AI can read public knowledge. Manufacturing intelligence must learn from proprietary fab data.

","url":"https://3dmmic.com/insights/f/why-proprietary-fab-data-matters-more-than-public-ai-models","title":"Why Proprietary Fab Data Matters More Than Public AI Models","summary":"Public AI can read public knowledge. Manufacturing intelligence must learn from proprietary fab data.","date_modified":"2026-07-09T07:00:09Z"},{"id":"https://3dmmic.com/insights/f/broadband-pa-proof-of-concept-what-the-results-mean","html_content":"

The broadband PA demonstration validates that 3DMMIC can reduce footprint while maintaining practical RF performance, shifting the design focus toward performance-per-area.

","url":"https://3dmmic.com/insights/f/broadband-pa-proof-of-concept-what-the-results-mean","title":"Broadband PA Proof-of-Concept: What the Results Mean","summary":"The broadband PA demonstration validates that 3DMMIC can reduce footprint while maintaining practical RF performance, shifting the design focus toward performance-per-area.","date_modified":"2026-07-08T09:36:58Z"},{"id":"https://3dmmic.com/insights/f/the-llm-native-generation-will-not-treat-ai-as-a-tool","html_content":"

For the next generation, AI will not merely answer questions. It will shape the space where questions are first formed.

","url":"https://3dmmic.com/insights/f/the-llm-native-generation-will-not-treat-ai-as-a-tool","title":"The LLM-Native Generation Will Not Treat AI as a Tool","summary":"For the next generation, AI will not merely answer questions. It will shape the space where questions are first formed.","date_modified":"2026-07-08T04:12:58Z"},{"id":"https://3dmmic.com/insights/f/rule-based-discipline-x-learning-based-adaptability","html_content":"

Smart manufacturing should avoid both extremes: pure rule rigidity and pure black-box AI.

","url":"https://3dmmic.com/insights/f/rule-based-discipline-x-learning-based-adaptability","title":"Rule-Based Discipline x Learning-Based Adaptability","summary":"Smart manufacturing should avoid both extremes: pure rule rigidity and pure black-box AI.","date_modified":"2026-07-07T13:01:02Z"},{"id":"https://3dmmic.com/insights/f/from-human-judgment-to-scalable-intelligence","html_content":"

The most valuable knowledge in complex systems often lives in human judgment before it becomes data.

","url":"https://3dmmic.com/insights/f/from-human-judgment-to-scalable-intelligence","title":"From Human Judgment to Scalable Intelligence","summary":"The most valuable knowledge in complex systems often lives in human judgment before it becomes data.","date_modified":"2026-07-06T12:21:57Z"},{"id":"https://3dmmic.com/insights/f/why-dispatching-is-the-first-high-value-use-case-for-fab-ai","html_content":"

Dispatching is where output, utilization, cycle time, delivery confidence, and Q-time risk meet.

","url":"https://3dmmic.com/insights/f/why-dispatching-is-the-first-high-value-use-case-for-fab-ai","title":"Why Dispatching Is the First High-Value Use Case for Fab AI","summary":"Dispatching is where output, utilization, cycle time, delivery confidence, and Q-time risk meet.","date_modified":"2026-07-03T09:23:38Z"},{"id":"https://3dmmic.com/insights/f/polymer-assisted-hybrid-bonding-for-3d-gaas-mmic-integration","html_content":"

For GaAs RF applications, 3D integration requires a bonding approach that balances electrical integrity, mechanical compliance, manufacturability, and process compatibility.

","url":"https://3dmmic.com/insights/f/polymer-assisted-hybrid-bonding-for-3d-gaas-mmic-integration","title":"Polymer-Assisted Hybrid Bonding for 3D GaAs MMICs Integration","summary":"For GaAs RF applications, 3D integration requires a bonding approach that balances electrical integrity, mechanical compliance, manufacturability, and process compatibility.","date_modified":"2026-07-03T07:33:13Z"},{"id":"https://3dmmic.com/insights/f/why-ai-is-not-just-another-automation-layer","html_content":"

The deeper question is not how AI automates tasks, but how it changes the way intelligence is formed, transferred, and scaled.

","url":"https://3dmmic.com/insights/f/why-ai-is-not-just-another-automation-layer","title":"Why AI Is Not Just Another Automation Layer","summary":"The deeper question is not how AI automates tasks, but how it changes the way intelligence is formed, transferred, and scaled.","date_modified":"2026-07-02T11:47:39Z"},{"id":"https://3dmmic.com/insights/f/not-chatbot-manufacturing-decision-intelligence","html_content":"

Most AI tools read what is written. 3DMMIC learns how experienced people decide.

","url":"https://3dmmic.com/insights/f/not-chatbot-manufacturing-decision-intelligence","title":"Not Chatbot. Manufacturing Decision Intelligence","summary":"Most AI tools read what is written. 3DMMIC learns how experienced people decide.","date_modified":"2026-07-02T10:38:41Z"},{"id":"https://3dmmic.com/insights/f/the-future-of-semiconductor-complexity","html_content":"

The next semiconductor frontier is not only smaller geometries or faster equipment. It is the ability to manage complexity across architecture, manufacturing, and intelligence.

","url":"https://3dmmic.com/insights/f/the-future-of-semiconductor-complexity","title":"The Future of Semiconductor Complexity","summary":"The next semiconductor frontier is not only smaller geometries or faster equipment. It is the ability to manage complexity across architecture, manufacturing, and intelligence.","date_modified":"2026-07-01T08:56:43Z"},{"id":"https://3dmmic.com/insights/f/from-human-expertise-to-manufacturing-intelligence","html_content":"

How 3DMMIC transforms hard-to-document shop-floor judgment into trainable, verifiable, and scalable manufacturing intelligence.

","url":"https://3dmmic.com/insights/f/from-human-expertise-to-manufacturing-intelligence","title":"From Human Expertise to Manufacturing Intelligence","summary":"How 3DMMIC transforms hard-to-document shop-floor judgment into trainable, verifiable, and scalable manufacturing intelligence.","date_modified":"2026-07-01T07:29:38Z"},{"id":"https://3dmmic.com/insights/f/separating-active-and-passive-functions-in-rf-mmics","html_content":"

3DMMIC partitions RF circuits into an Active Device Wafer and a Passive Device Wafer, creating a vertically integrated architecture for higher density, better area efficiency, and RF / EM / thermal co-design.

","url":"https://3dmmic.com/insights/f/separating-active-and-passive-functions-in-rf-mmics","title":"Separating Active and Passive Functions in RF MMICs","summary":"3DMMIC partitions RF circuits into an Active Device Wafer and a Passive Device Wafer, creating a vertically integrated architecture for higher density, better area efficiency, and RF / EM / thermal co-design.","date_modified":"2026-06-30T13:55:26Z"},{"id":"https://3dmmic.com/insights/f/the-overlooked-area-cost-of-passive-networks-in-gaas-mmics","html_content":"

In RF MMICs, passive networks are not secondary layout elements. They are central to performance — and often occupy a large portion of area on costly GaAs epitaxial wafer.

","url":"https://3dmmic.com/insights/f/the-overlooked-area-cost-of-passive-networks-in-gaas-mmics","title":"The Overlooked Area Cost of Passive Networks in GaAs MMICs","summary":"In RF MMICs, passive networks are not secondary layout elements. They are central to performance — and often occupy a large portion of area on costly GaAs epitaxial wafer.","date_modified":"2026-06-30T05:10:38Z"},{"id":"https://3dmmic.com/insights/f/why-conventional-mmic-layouts-are-reaching-their-limits","html_content":"

Passive networks and interconnect structures are becoming a major constraint in conventional GaAs MMIC layouts, limiting area efficiency, cost scalability, and RF design flexibility.

","url":"https://3dmmic.com/insights/f/why-conventional-mmic-layouts-are-reaching-their-limits","title":"Why Conventional 2D MMIC Layouts Are Reaching Their Limits","summary":"Passive networks and interconnect structures are becoming a major constraint in conventional GaAs MMIC layouts, limiting area efficiency, cost scalability, and RF design flexibility.","date_modified":"2026-06-29T07:50:03Z"}]}